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The AGS103T is an ultra-compact IoT gateway edge computing system integrating the Intel Atom® x6000E Series processors (code-named Elkhart Lake) that deliver up to 4 cores with 40% increase in CPU performance and improved graphics when compared with previous versions. Based on Intel's 10nm technology, the energy-efficient platform is suitable for embedded applications in factory automation, IoT gateway, edge computing and automatic control systems.
The ruggedized AGS103T boasts several advanced features such as an extended operating temperature range of -20°C to 70°C, three 2.5 Gigabit Ethernet ports for fast wired connections and multi-protocol communications, and over/under/reverse voltage protection. Useful I/O interfaces include 3052 M.2 B-Key, four COM (RS232/422/485), two USB 3.1 and two USB 2.0 sockets.
In addition, the low-power AGS103T supports DIN-rail and wall mounting installation, and onboard TPM 2.0 hardware-based security to ensure platform integrity. It is available with Intel® Atom® x6414RE x6212RE and with an option for an additional storage for 2.5" drives.
| System Mainboard | IB803T |
| CPU Type | Intel® Atom® x6414RE (1.5GHz, 1.5MB cache, 9W TDP) Intel® Atom® x6212RE (1.2GHz, 1.5MB cache, 6W TDP) |
| System Speed | Up to 1.5GHz |
| Memory | 1x 4GB DDR4-3200 SO-DIMM, Max. 16GB |
| Construction | Aluminum & steel |
| Chassis Color | Silver & Gray |
| Rear Panel External I/O | 1x DVI-I + 1x HDMI 2x USB 3.1 ports, 2x USB 2.0 port 3x RJ45 2.5G Ethernet port 4x LED indicators (GPIO, WLAN, WWAN) 1x power button with Green LED 1x 3-pin DC-in terminal block for 9V-36V 2x Antenna hole for WLAN module 2x RS232/422/485 ports for COM#3/COM#4 1x 4-in & 4-out GPIO |
| Left Panel External I/O | 2x RS232/422/485 ports for COM#1/COM#2 1x Antenna hole for WLAN module 1x Line-out/ Mic-in |
| Right Panel External I/O | 2x SIM card slot 1x Antenna hole for WLAN module |
| Expansion Slots | 1x Full-size Mini PCI-E socket (USB 2.0) 1x Full-size Mini PCI-E socket (USB 2.0 + SATA) 1x Full-size Mini PCI-E socket (USB 2.0 + PCI-E) 1x M.2 B-Key socket (USB 3.0 + PCI-E) |
| Storage / M.2 | 1x Mini PCI-E slot (mSATA SSD),1x 2.5’’ SSD (AGS103TS) |
| Mounting | DIN-rail mounting (DIN-rail mount kit included) Desktop or wall mounting (wall mount kit included) |
| Weight | 1.2kg |
| System Dimensions | 218mm(W) x 110mm(D) x 57mm(H) w/ Wall mount kit 8.58”(W) x 4.33”(D) x 2.24”(H) |
| Operating Temperature | -20°C~70°C (-4°F~158°F) |
| Storage Temperature | -40°C ~ 85°C (-40°F~185°F) |
| Relative Humidity | 5~90% @ 60°C, (non-condensing) |
| Vibration | Operating: 2.0 Grms / 5~500Hz / random operation (with IEC 60068-2-64) |
| Shock | Operating: 30G/11 ms Duration Non-operating: 40G/11 ms Duration |
| Certification | CE/ FCC/ LVD |
| Operating Systems | Win10 and Linux Ubuntu |
| AGS103T-6414M | Fanless DIN-rail System supports TPM2.0 w/ Intel® Atom® Processor x6414RE, 3x 2.5G Ethernet port, 4x COM, w/o memory, storage, power adaptor |
| AGS103TS-6414M | Fanless DIN-rail System supports TPM2.0 w/ Intel® Atom® Processor x6414RE, 3x 2.5G Ethernet port, 4x COM, w/o memory, storage, power adaptor, w/ 2.5” storage slot |
| AGS103T-6212M | Fanless DIN-rail System supports TPM2.0 w/ Intel® Atom® Processor x6212RE, 3x 2.5G Ethernet port, 4x COM, w/o memory, storage, power adaptor |
| AGS103TS-6212M | Fanless DIN-rail System supports TPM2.0 w/ Intel® Atom® Processor x6212RE, 3x 2.5G Ethernet port, 4x COM, w/o memory, storage, power adaptor, w/ 2.5” storage slot |
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