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RISC Platform
RM-H8MP-S
Wide-Temperature SOM Module with NXP Arm® i.MX 8M Plus Quad-core Cortex™-A53 1.6 GHz Processor
- NXP Cortex™-A53, i.MX 8M Plus Quad-core 1.6 GHz processor
- 3GB LPDDR4, 16GB eMMC
- Video decode/encode, up to 1080p/60fps.
- Extensive peripheral I/O support
- Low power design, no heatsink required
- Wide-range operating temperature (-40°C~85°C)
| Form Factor | SOM Module (System-on-Module) |
| Processor | NXP i.MX8M Plus Quad-core Cortex-A53 processor |
| System Memory | 3GB LPDDR4 on board (optional 1GB, 2GB or 4GB) |
| Flash Memory | 16GB eMMC on board (up to 64GB) |
| Display | HDMI 2.0 1x dual-channel LVDS 1x MIPI-DSI 4-lane |
| Video Codec | Up to 1080p decode, AVC/H.264, HEVC/H.265 Up to 1080p encode, AVC/H.264, HEVC/H.265 |
| Graphics | Open VG 1.1, Open GL ES 3.1, Vulkan, Open CL 1.2 FP |
| Audio Interface | 2x SAI |
| LAN | 2x GbE GMAC |
| USB | 2x USB 3.0 |
| Image Capture Interface | 2x MIPI-CSI (4 lanes) |
| Serial Interface | 4x UART, 1x CSPI, 1x QSPI Interface |
| Media Interface | 2x High-speed SDIO |
| PCI-E | 1x PCI-E (Gen3) |
| SATA | N/A |
| GPIO | Up to 46 GPIO |
| I²C | 4x I²C |
| Others | N/A |
| CAN Bus | 2x CAN FD |
| Dimensions | 36mm x 49mm (1.4” x 1.9”) |
| Environment | Humidity: 0 % to 90 % RH at 60° C (non-condensing) Shock: Non-Operating: 1G, 15 mins (x-, y-, z-axis) Vibration: Non-operating: 3 Hz to 500 Hz, 15 mins |
| Operating Temperature | -40°C~+85°C (-40°F ~ 185°F) |
| OS Support | Yocto 3.0 (sumo, kernel 5.4.70) Android 11 |
| Certification | CE/ FCC Class-A |
| RM-H8MP-S | RISC System on Module, 3GB LPDDR4, 16GB eMMC |
| DATASHEETS | RM-H8MP-S |
| CATALOGS | RISC-Based Embedded Solutions (Vol.25.05) |
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